The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2016
Filed:
Oct. 12, 2013
Applicant:
Cisco Technology, Inc., San Jose, CA (US);
Inventor:
Mohan R. Nagar, Cupertino, CA (US);
Assignee:
Cisco Technology, Inc., San Jose, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); H01J 5/00 (2006.01); H01J 15/00 (2006.01); H05K 5/06 (2006.01); H01L 27/148 (2006.01); H01L 23/552 (2006.01); B21D 39/00 (2006.01); G06F 1/18 (2006.01); H01R 13/648 (2006.01); H05K 3/30 (2006.01); G03B 15/03 (2006.01); H01R 13/516 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0007 (2013.01); G06F 1/181 (2013.01); G06F 1/182 (2013.01); H01R 13/648 (2013.01); H05K 9/00 (2013.01); H05K 9/0009 (2013.01); G03B 15/03 (2013.01); H01R 13/516 (2013.01); H05K 3/30 (2013.01);
Abstract
An apparatus for grounding a chip may be provided. The apparatus may comprise a ground lid, a ground trace, a first substance, and a second substance. The first substance may be configured adhere the ground lid to the ground trace. The second substance may be configured to provide electrical conduction between the ground lid and the ground trace.