The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2005
Filed:
Feb. 21, 2003
Mohan R. Nagar, Milpitas, CA (US);
Aritharan Thurairajaratnam, San Jose, CA (US);
Mohan R. Nagar, Milpitas, CA (US);
Aritharan Thurairajaratnam, San Jose, CA (US);
LSI Logic Corporation, Milpitas, CA (US);
Abstract
A probe structure for testing impedance of a package substrate using time domain reflectometry. A connector electrically connects the probe structure to a time domain reflectometry tester, where the connector has a signal conductor and a ground conductor. An electrically conductive cantilever signal pin is electrically connected to the signal conductor. The electrically conductive cantilever signal pin has a tip for making an electrical connection with an electrically conductive structure to be tested on the package substrate. The electrically conductive cantilever signal pin is electrically isolated by and sheathed within a ground shield that is electrically connected to at least one of the ground conductor and electrically conductive cantilever ground pins. The electrically conductive cantilever ground pins are electrically connected to the ground conductor. The electrically conductive cantilever ground pins also have tips, for making electrical connections with electrically conductive structures on the package substrate that surround the electrically conductive structure to be tested on the package substrate.