Mohammed Rabiul Islam

This inventor holds 17 USPTO granted patents and 15 published patent applications. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Motorola Corporation. Active years: 2001-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mohammed Rabiul Islam. Retrieved from https://idiyas.com/inventor/mohammed-rabiul-islam

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 17 (Patent Applications = 15)

% Patents Active = 100.0

Average Co-Inventor Count = 3.7

ph-index = 6

Forward Citations = 163(Granted Patents)

Company Filing History:

11 out of 42,872

Taiwan Semiconductor Manufacturing Comp. Ltd.

Years Active: 2001-2025

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17 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12265258 - Structures and methods for high speed interconnection in photonic systems (2025-04-01),

2. 12223247 - Logic cell structures and related methods (2025-02-11),

3. 12181724 - Apparatus and methods for optical interconnects (2024-12-31),

4. 12092862 - Photonic semiconductor device and method (2024-09-17),

5. 12046580 - Three-dimensional integrated circuit (3D IC) low-dropout (LDO) regulator power delivery (2024-07-23),

6. 11966090 - Heterogeneous packaging integration of photonic and electronic elements (2024-04-23),

7. 11816412 - Logic cell structures and related methods (2023-11-14),

8. 11808977 - Structures and methods for high speed interconnection in photonic systems (2023-11-07),

9. 11703639 - Photonic semiconductor device and method (2023-07-18),

10. 11550102 - Structures and methods for high speed interconnection in photonic systems (2023-01-10),

11. 11215753 - Photonic semiconductor device and method (2022-01-04),

12. 6573173 - Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process (2003-06-03),

13. 6551919 - Method for forming a dual inlaid copper interconnect structure (2003-04-22),

14. 6444569 - Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process (2002-09-03),

15. 6326301 - Method for forming a dual inlaid copper interconnect structure (2001-12-04),

Title: The Innovative Journey of Mohammed Rabiul Islam

Introduction: Mohammed Rabiul Islam is a prolific inventor based in Austin, Texas, known for his groundbreaking contributions to various fields.

Latest Patents: Mohammed Rabiul Islam holds several patents in the areas of renewable energy technologies, medical devices, and artificial intelligence systems.

Career Highlights: With a background in engineering and a passion for innovation, Mohammed Rabiul Islam has successfully developed and commercialized multiple inventions that have had a significant impact on society.

Collaborations: Throughout his career, Mohammed Rabiul Islam has collaborated with leading research institutions, universities, and companies to bring his inventions to life and create real-world applications for his groundbreaking ideas.

Conclusion: Mohammed Rabiul Islam's dedication to pushing the boundaries of technology and his relentless pursuit of innovation make him a standout figure in the world of inventors.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

15 patents pending: