Mitsutaka Tsubokura

Title: The Innovations of Mitsutaka Tsubokura

Introduction

Mitsutaka Tsubokura is a notable inventor based in Itami, Japan. He has made significant contributions to the field of printed wiring and circuit boards, holding a total of six patents. His work has advanced the technology used in electronic components, showcasing his expertise and innovative spirit.

Latest Patents

Tsubokura's latest patents include a printed wiring board that features a base layer with insulating properties and multiple conductive layers. This design incorporates copper foils and a unique stacked body for a via hole, which connects the conductive layers through a connection hole. The copper foils are characterized by a specific crystal grain orientation and size, enhancing their performance. Another significant patent is for a printed circuit board that also utilizes copper foils and an insulating base layer, featuring a via-hole laminate with electroless and electrolytic copper plating layers. These innovations reflect Tsubokura's commitment to improving electronic circuit technology.

Career Highlights

Throughout his career, Mitsutaka Tsubokura has worked with prominent companies such as Sumitomo Electric Industries and Sumitomo Electric Printed Circuits. His experience in these organizations has allowed him to develop and refine his inventions, contributing to advancements in the industry.

Collaborations

Tsubokura has collaborated with notable colleagues, including Junichi Motomura and Koji Nitta. Their teamwork has likely played a role in the successful development of his innovative patents.

Conclusion

Mitsutaka Tsubokura's contributions to the field of printed wiring and circuit boards demonstrate his innovative capabilities and dedication to advancing technology. His patents reflect a deep understanding of materials and design, positioning him as a key figure in the electronics industry.