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For the Inventor, By the Inventor

Kanuma, Japan

Mitsuhiro Fukuda

This inventor holds 7 USPTO granted patents. Top assignees: Sony Chemicals Corporation, Sony Corporation. Active years: 2002-2006.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mitsuhiro Fukuda. Retrieved from https://idiyas.com/inventor/mitsuhiro-fukuda-62g3ae64

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 7

% Patents Active = 71.4

Average Co-Inventor Count = 4.1

ph-index = 4

Forward Citations = 52(Granted Patents)


Location History:

  • Tochigi, JP (2002)
  • Kanuma, JP (2003 - 2006)

Company Filing History:

goldMedal7 out of 186 
 
Sony Chemicals Corporation
 patents
silverMedal1 out of 58,147 
 
Sony Corporation
 patents
where one patent can have more than one assignee

Years Active: 2002-2006

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7 patents (USPTO):Explore Patents
1. 6991148 - Process for manufacturing multilayer flexible wiring boards (2006-01-31),
2. 6926187 - Ultrasonic manufacturing apparatus (2005-08-09),
3. 6840430 - Board pieces, flexible wiring boards and processes for manufacturing flexible wiring boards (2005-01-11),
4. 6596947 - Board pieces, flexible wiring boards, and processes for manufacturing flexible wiring boards (2003-07-22),
5. 6583364 - Ultrasonic manufacturing apparatuses, multilayer flexible wiring boards and processes for manufacturing multilayer flexible wiring boards (2003-06-24),
6. 6437251 - Flexible board made by joining two pieces through an adhesive film (2002-08-20),
7. 6395993 - Multilayer flexible wiring boards (2002-05-28),

Title: The Innovations of Mitsuhiro Fukuda

Introduction

Mitsuhiro Fukuda is a notable inventor based in Kanuma, Japan. He has made significant contributions to the field of multilayer flexible wiring boards, holding a total of seven patents. His work has been instrumental in advancing technology in this area.

Latest Patents

Fukuda's latest patents include a process for manufacturing multilayer flexible wiring boards. This invention features first and second patterned wiring layers, with a resin film interposed between them. The resin film is designed to form an opening when a bump is forced into it while an ultrasonic wave is applied. This innovative approach allows for the bump to be left in the opening, establishing an electrical connection to the first wiring layer. Another significant patent is the ultrasonic manufacturing apparatus, which also pertains to multilayer flexible wiring boards and incorporates similar features to enhance manufacturing processes.

Career Highlights

Throughout his career, Fukuda has worked with prominent companies such as Sony Chemicals Corporation and Sony Corporation. His experience in these organizations has allowed him to develop and refine his inventions, contributing to the advancement of technology in the electronics industry.

Collaborations

Fukuda has collaborated with notable colleagues, including Hideyuki Kurita and Masanao Watanabe. These partnerships have fostered innovation and creativity in his projects.

Conclusion

Mitsuhiro Fukuda's contributions to the field of multilayer flexible wiring boards demonstrate his expertise and commitment to innovation. His patents reflect a deep understanding of technology and its applications in modern electronics.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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