Mitsuhiro Fukuda

Title: The Innovations of Mitsuhiro Fukuda

Introduction

Mitsuhiro Fukuda is a notable inventor based in Kanuma, Japan. He has made significant contributions to the field of multilayer flexible wiring boards, holding a total of seven patents. His work has been instrumental in advancing technology in this area.

Latest Patents

Fukuda's latest patents include a process for manufacturing multilayer flexible wiring boards. This invention features first and second patterned wiring layers, with a resin film interposed between them. The resin film is designed to form an opening when a bump is forced into it while an ultrasonic wave is applied. This innovative approach allows for the bump to be left in the opening, establishing an electrical connection to the first wiring layer. Another significant patent is the ultrasonic manufacturing apparatus, which also pertains to multilayer flexible wiring boards and incorporates similar features to enhance manufacturing processes.

Career Highlights

Throughout his career, Fukuda has worked with prominent companies such as Sony Chemicals Corporation and Sony Corporation. His experience in these organizations has allowed him to develop and refine his inventions, contributing to the advancement of technology in the electronics industry.

Collaborations

Fukuda has collaborated with notable colleagues, including Hideyuki Kurita and Masanao Watanabe. These partnerships have fostered innovation and creativity in his projects.

Conclusion

Mitsuhiro Fukuda's contributions to the field of multilayer flexible wiring boards demonstrate his expertise and commitment to innovation. His patents reflect a deep understanding of technology and its applications in modern electronics.