The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2005
Filed:
Apr. 28, 2003
Hideyuki Kurita, Yokohama, JP;
Masanao Watanabe, Kanuma, JP;
Masayuki Nakamura, Kanuma, JP;
Mitsuhiro Fukuda, Kanuma, JP;
Hiroyuki Usui, Kanuma, JP;
Hideyuki Kurita, Yokohama, JP;
Masanao Watanabe, Kanuma, JP;
Masayuki Nakamura, Kanuma, JP;
Mitsuhiro Fukuda, Kanuma, JP;
Hiroyuki Usui, Kanuma, JP;
Sony Chemicals Corp., Tokyo, JP;
Abstract
The present invention pertains to a multilayer flexible wiring board. The multilayer flexible wiring board including first and second patterned wiring layers, a resin film interposed between a surface of the first wiring layer and a surface of the second wiring layer, and a bump connected to the surface of the second wiring layer, wherein the resin film is adapted to form an opening when the bump to force into the resin film and an ultrasonic wave is applied to the bump and the bump is left in the opening to electrically connect the top of the bump to the first wiring layer.