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Sony Chemicals Corporation

USPTO Granted Patents = 186

% Expired Patents = 10.8

EPO Patents = 4

Forward Citations = 1,866

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149 inventors (with patents filed for the assignee):

Hideyuki Kurita (23 out of 24 patents)

Motohide Takeichi (16 out of 16 patents)

Yukio Yamada (13 out of 24 patents)

4. Masayuki Nakamura (11 out of 28 patents)

5. Hiroyuki Hishinuma (10 out of 11 patents)

6. Masanao Watanabe (10 out of 12 patents)

7. Tetsuya Abe (9 out of 159 patents)

8. Norikazu Iwasaki (9 out of 12 patents)

9. Hideaki Takahashi (9 out of 11 patents)

10. Masahiro Fujimoto (9 out of 10 patents)

11. Satoshi Takahashi (8 out of 142 patents)

12. Yutaka Kaneda (8 out of 11 patents)

13. Toshihiro Shinohara (8 out of 10 patents)

14. Akira Tsutsumi (8 out of 10 patents)

15. Katsuhisa Orihara (7 out of 39 patents)

Core Competencies:

Flexible Wiring Boards

Adhesives

Thermal Transfer Media

Conductive Particle

Protective Circuit

Multilayer Boards

Wiring Circuit Board

Polyamic Acid Varnish

Sublimation Thermal Transfer

Printing Media

Fire-Retardant Adhesives

Optical Recording Media

186 patents: Sort by Forward Citations

1. 7535332 - Protective element (2009-05-19),

2. 7478052 - Contents market research system, contents market research apparatus, contents polling apparatus, contents market research method, and recording medium (2009-01-13),

3. 7413686 - Conductive particle and adhesive agent (2008-08-19),

4. 7157125 - Doubled-faced tape (2007-01-02),

5. 7144817 - Etching solutions and processes for manufacturing flexible wiring boards (2006-12-05),

6. 7109058 - Bumpless semiconductor device (2006-09-19),

7. 7098267 - Polyamic acid varnish composition and a flexible printed board (2006-08-29),

8. 7098132 - Method of manufacturing flexible wiring board (2006-08-29),

9. 7088216 - Protective device (2006-08-08),

10. 7079003 - Secondary battery with protective circuit (2006-07-18),

11. 7076868 - Wiring circuit board having bumps and method of producing same (2006-07-18),

12. 7074741 - Sublimation thermal transfer recording medium and thermal transfer recording method using the same (2006-07-11),

13. 7053312 - Flexible wiring boards (2006-05-30),

14. 7034750 - Antenna mounting printed-circuit board (2006-04-25),

15. 7025852 - Connecting material and mounting method which uses same (2006-04-11),

Company Overview

Sony Chemicals Corporation, headquartered in Tokyo, Japan, specializes in the development and manufacturing of advanced flexible wiring boards and related technologies. The company focuses on core areas such as adhesives, thermal transfer media, conductive particles, and protective circuits, catering to the evolving needs of the electronics industry. With expertise in multilayer boards and wiring circuit boards, Sony Chemicals is positioned at the forefront of innovation in flexible electronics, contributing to the advancement of modern technology.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 6 2026

186 Patents

#376 in Tokyo

#745 in Japan

#4,510 in the World

Sony Chemicals Corporation

Forward Citations = 1,866

149 inventors:

Hideyuki Kurita (23 out of 24 patents)

Motohide Takeichi (16 out of 16 patents)

Yukio Yamada (13 out of 24 patents)

4. Masayuki Nakamura (11 out of 28 patents)

5. Hiroyuki Hishinuma (10 out of 11 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Sony Chemicals Corporation. Retrieved from https://idiyas.com/company/sony-chemicals

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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