The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2006
Filed:
Aug. 14, 2003
Hiroyuki Hishinuma, Kanuma, JP;
Hideyuki Kurita, Yokohama, JP;
Ryo Ito, Kanuma, JP;
Masayuki Nakamura, Kanuma, JP;
Hiroyuki Hishinuma, Kanuma, JP;
Hideyuki Kurita, Yokohama, JP;
Ryo Ito, Kanuma, JP;
Masayuki Nakamura, Kanuma, JP;
Sony Corporation, Tokyo, JP;
Sony Chemicals Corp., Tokyo, JP;
Abstract
A flexible wiring board are formed by growing metal bumps using a mask film patterned by photolithography. Fine openings can be formed with good precision, therefore, fine metal bumps can be formed with good precision because laser beam is not used to form opening in a polyimide film. After metal bumps have been formed, the mask film is removed and a liquid resin material is applied and dried to form a coating, which is then cured into a resin film. The coating can be etched at surface portions during coating stage to exposed the tops of metal bumps.