The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 11, 2006
Filed:
May. 16, 2003
Applicant:
Hiroyuki Kumakura, Kanuma, JP;
Inventor:
Hiroyuki Kumakura, Kanuma, JP;
Assignees:
Sony Corporation, Tokyo, JP;
Sony Chemicals Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 31/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A connecting material containing a thermosetting resin has a surface tension of 25 to 40 mN/m (at 25° C.). The connecting material contains a surfactant to adjust the surface tension to 25 to 40 mN/m (at 25° C.). The surfactant is a silicone resin-based surfactant or a fluorine resin-based surfactant. The ratio of surfactant content is 0.01 to 5.0 wt pts per 100 wt pts resin content in the connecting material.
Quick Actions:
Kumakura, Hiroyuki. (2006). Connecting material and mounting method which uses same (U.S. Patent No. 7025852). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7025852
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile