Kanuma, Japan

Hiroyuki Usui


Average Co-Inventor Count = 5.0

ph-index = 2

Forward Citations = 16(Granted Patents)


Company Filing History:


Years Active: 2003-2006

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3 patents (USPTO):Explore Patents

Title: Hiroyuki Usui: Innovator in Flexible Wiring Board Technology

Introduction

Hiroyuki Usui, an accomplished inventor based in Kanuma, Japan, has made significant contributions to the field of multilayer flexible wiring board technology. With a total of three patents to his name, Usui's innovations have advanced the capabilities and functionalities of electronic components.

Latest Patents

Among his latest patents, the "Process for Manufacturing Multilayer Flexible Wiring Boards" stands out. This invention introduces a multilayer flexible wiring board that includes first and second patterned wiring layers. A resin film is interposed between these layers, allowing for a bump that connects to the surface of the second wiring layer. The resin film is engineered to form an opening when the bump is forced into it and exposed to an ultrasonic wave, ensuring electrical connectivity with the first wiring layer.

Another notable patent is the "Ultrasonic Manufacturing Apparatus" which also pertains to multilayer flexible wiring boards. The apparatus describes a similar construction as his previous patent, emphasizing the use of ultrasound technology to enhance the manufacturing process.

Career Highlights

Hiroyuki Usui's career has been marked by his work at prominent companies such as Sony Chemicals Corporation and Sony Corporation. His tenure at these organizations has provided him with the platform to develop and refine his innovative ideas in electronic component manufacturing.

Collaborations

Throughout his career, Usui has collaborated with notable coworkers including Hideyuki Kurita and Masanao Watanabe. These collaborations have likely fostered an environment of creativity and technical advancement in the projects he has worked on.

Conclusion

Hiroyuki Usui's innovative work, particularly within the realm of multilayer flexible wiring boards, exemplifies the spirit of invention. His contributions promise to shape the future of electronics, providing essential advancements that enhance the functionality and performance of electronic devices.

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