The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 11, 2005
Filed:
Jun. 10, 2003
Hideyuki Kurita, Yokohama, JP;
Masanao Watanabe, Kanuma, JP;
Toshihiro Shinohara, Kanuma, JP;
Mitsuhiro Fukuda, Kanuma, JP;
Yukio Anzai, Kanuma, JP;
Hideyuki Kurita, Yokohama, JP;
Masanao Watanabe, Kanuma, JP;
Toshihiro Shinohara, Kanuma, JP;
Mitsuhiro Fukuda, Kanuma, JP;
Yukio Anzai, Kanuma, JP;
Sony Chemicals, Corp., Tokyo, JP;
Abstract
A board pieceof the present invention comprises a non-thermoplastic resin film, a thermoplastic resin filmformed on the non-thermoplastic resin filmand a metal wiringformed on the surface of the thermoplastic resin film. Metal wiringis partially exposed on board pieceto form a contact. A low-melting metal coatingis formed on contactand two board piecesare pressed against each other under heating with contactsthereof being in contact with each other so that thermoplastic resin filmssoften to adhere board piecesto each other and low-melting metal coatingsmelt and then solidify to connect contactsto each other. The region of metal wiringnot used for connection is wiringconnecting contactsto each other and a cover filmcan be provided on the surface thereof. Contactscan also be connected by applying ultrasonic wave.