Tochigi, Japan

Yukio Anzai


Average Co-Inventor Count = 4.3

ph-index = 3

Forward Citations = 18(Granted Patents)


Location History:

  • Kanuma, JP (2003 - 2005)
  • Tochigi, JP (2002 - 2007)

Company Filing History:


Years Active: 2002-2007

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4 patents (USPTO):Explore Patents

Title: Innovations by Yukio Anzai

Introduction

Yukio Anzai is a notable inventor based in Tochigi, Japan. He has made significant contributions to the field of flexible wiring boards, holding a total of four patents. His work focuses on improving the reliability and efficiency of electrical connections in various applications.

Latest Patents

One of Anzai's latest patents is for a flexible wiring board designed for double-side connection. This innovative board enhances the reliability of connections to circuit boards and outlines a manufacturing process that utilizes a polyimide film with a strategically placed through-hole. The design includes first and second electrodes on either side of the film, ensuring that any adhesive used does not flow through the hole, thereby maintaining the integrity of the connection.

Another patent involves board pieces and processes for manufacturing flexible wiring boards. This invention comprises a non-thermoplastic resin film and a thermoplastic resin film, with metal wiring partially exposed to form contacts. The innovative process allows for the adhesion of board pieces through heating, ensuring a strong connection between contacts.

Career Highlights

Yukio Anzai has worked with prominent companies such as Sony Chemicals Corporation and Sony Corporation. His experience in these organizations has contributed to his expertise in the field of electrical engineering and innovation.

Collaborations

Anzai has collaborated with notable individuals in his field, including Hideyuki Kurita and Masanao Watanabe. These collaborations have likely enriched his work and led to further advancements in his inventions.

Conclusion

Yukio Anzai's contributions to flexible wiring technology demonstrate his innovative spirit and commitment to enhancing electrical connections. His patents reflect a deep understanding of materials and processes that improve reliability in electronic applications.

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