The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2002
Filed:
Feb. 17, 2000
Hideyuki Kurita, Tokyo, JP;
Masanao Watanabe, Tochigi, JP;
Toshihiro Shinohara, Tochigi, JP;
Yukio Anzai, Tochigi, JP;
Mitsuhiro Fukuda, Tochigi, JP;
Sony Chemicals Corp., Tokyo, JP;
Abstract
This invention provides a specially-shaped, double-face flexible printed wiring board having a small pitch at a high production yield. Metal wirings and formed on a base film of two elemental pieces and of a flexible printed wiring board are arranged in such a manner as to face each other while sandwiching a bonding film not containing conductive particles between them, and are heat-pressed to each other. The adhesive resin film so softened is pushed aside from the metal wirings and and the low melting point metal coating films and formed on the surface of the metal wirings and come into direct contact with each other and are fused. In this instance, the softened adhesive resin film is charged between the metal wirings and . Therefore, the molten low melting point metal does not scatter. The base films and are bonded by the adhesive resin film