The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 2003
Filed:
Jan. 18, 2002
Hideyuki Kurita, Yokohama, JP;
Masanao Watanabe, Kanuma, JP;
Toshihiro Shinohara, Kanuma, JP;
Mitsuhiro Fukuda, Kanuma, JP;
Yukio Anzai, Kanuma, JP;
Sony Chemicals Corp., Tokyo, JP;
Abstract
A board piece of the present invention comprises a non-thermoplastic resin film , a thermoplastic resin film formed on the non-thermoplastic resin film and a metal wiring formed on the surface of the thermoplastic resin film . Metal wiring is partially exposed on board piece to form a contact . A low-melting metal coating is formed on contact and two board pieces are pressed against each other under heating with contacts thereof being in contact with each other so that thermoplastic resin films soften to adhere board pieces to each other and low-melting metal coatings melt and then solidify to connect contacts to each other. The region of metal wiring not used for connection is wiring connecting contacts to each other and a cover film can be provided on the surface thereof. Contacts can also be connected by applying ultrasonic wave.