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For the Inventor, By the Inventor

Changhua, Taiwan

Ming-Tsung Chen

This inventor holds 26 USPTO granted patents and 8 published patent applications, primarily in Solid Electrolytic Capacitors. Top assignees: Apaq Technology Co., Ltd., Inpaq Technology Co., Ltd.. Active years: 2012-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ming-Tsung Chen. Retrieved from https://idiyas.com/inventor/ming-tsung-chen

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 26 

% Patents Active = 53.8

Average Co-Inventor Count = 2.4

ph-index = 1

Forward Citations = 9(Granted Patents)


Location History:

  • Changhua County, TW (2012 - 2022)
  • Hsinchu, TW (2013 - 2022)

Company Filing History:

goldMedal26 out of 55 
 
Apaq Technology Co., Ltd.
 patents
silverMedal2 out of 69 
 
Inpaq Technology Co., Ltd.
 patents
where one patent can have more than one assignee

Years Active: 2012-2022

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Areas of Expertise:
Capacitor Package Structure
Winding-Type Capacitor
Solid-State Electrolytic Capacitor
Polymer Composite Material
Electrode Structure
Stacked-Type Capacitor
Conductive Terminals
Insulating Encapsulation
Lamellar Stacked Capacitor
Manufacturing Method
Electrical Performance
Non-Symmetrical Electrode
26 patents (USPTO):Explore Patents
1. 11488786 - Winding-type capacitor package structure and method of manufacturing the same (2022-11-01),
2. 11424079 - Winding type capacitor assembly with enhanced structural strength and method of manufacturing the same (2022-08-23),
3. 11004616 - Low leakage electrolytic capacitor (2021-05-11),
4. 10513602 - Polymer composite material, method for manufacturing the polymer composite material, capacitor package structure using the polymer composite material and method for manufacturing the capacitor package structure (2019-12-24),
5. 10361036 - Capacitor package structure (2019-07-23),
6. 10249446 - Stacked-type solid electrolytic capacitor package structure and method of manufacturing the same (2019-04-02),
7. 10192687 - Capacitor assembly having a non-symmetrical electrode structure and capacitor seat structure thereof (2019-01-29),
8. 10163576 - Capacitor cathode foil structure and manufacturing method thereof (2018-12-25),
9. 10079114 - Stacked-type solid electrolytic capacitor capable of increasing welding effect and manufacturing method of the same (2018-09-18),
10. 10068711 - Solid electrolytic capacitor package structure for increasing electrical performances and method of manufacturing the same, and capacitor unit thereof (2018-09-04),
11. 9824827 - Method for making solid electrolytic capacitor package structure with improved conductive terminals (2017-11-21),
12. 9754729 - Solid-state electrolytic capacitor with improved metallic anode and method for manufacturing the same (2017-09-05),
13. 9653216 - Sealing element and wound-type solid state electrolytic capacitor thereof (2017-05-16),
14. 9627149 - Solid electrolytic chip capacitor and manufacturing method thereof (2017-04-18),
15. 9490075 - Method for fabricating solid electrolytic capacitors (2016-11-08),

Title: Innovations of Ming-Tsung Chen in Capacitor Technology

Introduction

Ming-Tsung Chen, a distinguished inventor based in Changhua County, Taiwan, holds an impressive portfolio of 26 patents. His contributions to capacitor technology have garnered significant attention in the field of electrical engineering. Through innovative designs and manufacturing methods, he continues to advance the performance and reliability of capacitor assemblies.

Latest Patents

Ming-Tsung Chen's latest patents include:

1. **Winding-Type Capacitor Package Structure and Method of Manufacturing the Same** - This innovative patent describes a comprehensive winding-type capacitor package structure that comprises a winding assembly, package assembly, and conductive assembly. The design features fully enclosed winding assembly, ensuring protection and efficiency.

2. **Winding Type Capacitor Assembly with Enhanced Structural Strength and Method of Manufacturing the Same** - This patent involves a winding type capacitor assembly that uses isolation elements between conductive foils and incorporates an electrolyte filler. This construction enhances the structural strength of the capacitor, optimizing its performance and durability.

Career Highlights

Ming-Tsung Chen has made significant strides in his career by working with notable companies such as Apaq Technology Co., Ltd. and Inpaq Technology Co., Ltd. His experience in these organizations has allowed him to apply his innovative ideas effectively and contribute to advancements in capacitor technology.

Collaborations

Throughout his career, Ming-Tsung Chen has collaborated with skilled professionals like Ching-Feng Lin and Chi-Hao Chiu. These collaborations have facilitated the exchange of ideas and the development of cutting-edge technologies in the field of capacitors.

Conclusion

Ming-Tsung Chen stands out as a prominent inventor in the capacitor industry, with his numerous patents and innovative designs making significant contributions to electrical engineering. His work continues to shape the future of capacitor technology, reflecting his commitment to innovation and excellence.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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