The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2017

Filed:

Oct. 19, 2015
Applicant:

Apaq Technology Co., Ltd., Miaoli County, TW;

Inventors:

Ming-Tsung Chen, Changhua County, TW;

Yi-Ying Wang, Hsinchu, TW;

Assignee:

APAQ TECHNOLOGY CO., LTD., Miaoli County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 9/15 (2006.01); H01G 9/00 (2006.01); H01G 9/04 (2006.01); H01G 9/048 (2006.01); H01G 9/042 (2006.01);
U.S. Cl.
CPC ...
H01G 9/15 (2013.01); H01G 9/0029 (2013.01); H01G 9/04 (2013.01); H01G 9/048 (2013.01); H01G 9/0425 (2013.01);
Abstract

A solid electrolytic chip capacitor is provided which comprises a substrate layer, an electrical insulating block, a conductive polymer layer, a patterned reinforcement layer, and an electrode layer. The electrical insulating block is formed on the substrate layer to define an anode region and a cathode region on the substrate layer. The conductive polymer layer is formed to cover the cathode region of the substrate layer. The patterned reinforcement layer is formed to cover the conductive polymer. The electrode layer is formed to cover the patterned reinforcement layer. Whereby, the mechanical strength of the chip solid electrolytic capacitor can be improved without loss of capacitance.


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