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For the Inventor, By the Inventor

Miaoli, Taiwan

Apaq Technology Co., Ltd.


USPTO Granted Patents = 55

% Expired Patents = 43.6

Trademarks = 4

Forward Citations = 17

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32 inventors (with patents filed for the assignee):

goldMedal Ming-Tsung Chen (26 out of 26 patents)

silverMedal Ching-Feng Lin (22 out of 23 patents)

bronzeMedal Chi-Hao Chiu (15 out of 15 patents)

4.  Chieh Lin (14 out of 16 patents)

5.  Ming-Goo Chien (7 out of 8 patents)

6.  Kun-Huang Chang (7 out of 10 patents)

7.  Chun-Chia Huang (7 out of 7 patents)

8.  Chung-Jui Su (6 out of 7 patents)

9.  Shang-Che Lan (3 out of 3 patents)

10.  Wen-Yen Huang (3 out of 3 patents)

11.  Yi-Ying Wang (2 out of 4 patents)

12.  Chien-Wei Lin (2 out of 2 patents)

13.  Kuo-Chen Huang (2 out of 2 patents)

14.  Ming-Tsung Liang (2 out of 3 patents)

15.  Wei-Chih Lee (2 out of 4 patents)


Core Competencies:
Capacitor Package Structure
Solid Electrolytic Capacitor
Manufacturing Method
Winding-Type Capacitor
Stacked Capacitor
Polymer Composite Material
Integrated Circuit Product
Low Leakage Electrolytic Capacitor
Conductive Structure
Electrode Foil
Thin Film Capacitor
Electrical Performances

55 patents:

1. 12354810 - Wound capacitor package structure (2025-07-08),
2. 11854749 - Method of manufacturing capacitor assembly package structure (2023-12-26),
3. 11817273 - Capacitor element (2023-11-14),
4. 11640879 - Winding capacitor package structure and method of manufacturing the same (2023-05-02),
5. 11640878 - Winding capacitor package structure and method of manufacturing the same (2023-05-02),
6. 11626255 - Capacitor assembly package structure (2023-04-11),
7. 11610741 - Stacked solid electrolytic capacitor, integrated circuit product and electronic product (2023-03-21),
8. 11488786 - Winding-type capacitor package structure and method of manufacturing the same (2022-11-01),
9. 11424079 - Winding type capacitor assembly with enhanced structural strength and method of manufacturing the same (2022-08-23),
10. 11404218 - Capacitor element and method for manufacturing the same (2022-08-02),
11. 11335512 - Capacitor assembly structure and method of manufacturing the same (2022-05-17),
12. 11177075 - Method for forming polymer composite material onto capacitor element (2021-11-16),
13. 11004616 - Low leakage electrolytic capacitor (2021-05-11),
14. 10755862 - Device for manufacturing a multilayer stacked structure and method for manufacturing a thin film capacitor (2020-08-25),
15. 10658122 - Capacitor package structure with functional coating and method for manufacturing the same (2020-05-19),
Company Overview
Apaq Technology Co., Ltd. is a prominent player in the capacitor technology sector, headquartered in Miaoli, Taiwan. The company specializes in the development and manufacturing of advanced capacitor solutions, including solid electrolytic capacitors, winding-type capacitors, and stacked capacitors. Apaq's expertise extends to innovative capacitor package structures and polymer composite materials, catering to the needs of integrated circuit products. Their commitment to low leakage electrolytic capacitors positions them as a key contributor to the electronics industry.
Profile summary synthesized from public USPTO records and patent filings.

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USPTO Data Jan 1 1976 - Oct 20 2026

55 Patents

#5 in Miaoli

#371 in Taiwan

#12,932 in the World

Miaoli, TW
Miaoli, Taiwan

Apaq Technology Co., Ltd.

Forward Citations = 17

32 inventors:

goldMedal Ming-Tsung Chen (26 out of 26 patents)

silverMedal Ching-Feng Lin (22 out of 23 patents)

bronzeMedal Chi-Hao Chiu (15 out of 15 patents)

4.  Chieh Lin (14 out of 16 patents)

5.  Ming-Goo Chien (7 out of 8 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Apaq Technology Co., Ltd.. Retrieved from https://idiyas.com/company/apaq-technology-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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