The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 11, 2023

Filed:

Sep. 18, 2020
Applicant:

Apaq Technology Co., Ltd., Miaoli County, TW;

Inventor:

Chieh Lin, Hsinchu County, TW;

Assignee:

APAQ TECHNOLOGY CO., LTD., Miaoli County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 9/012 (2006.01); H01G 9/08 (2006.01); H01G 9/15 (2006.01);
U.S. Cl.
CPC ...
H01G 9/012 (2013.01); H01G 9/08 (2013.01); H01G 9/15 (2013.01);
Abstract

A capacitor assembly package structure and a method of manufacturing the same are provided. The capacitor assembly package structure includes a capacitor unit, an insulative package body, a conductive connection layer and an electrode unit. The capacitor unit includes a plurality of capacitors, and each capacitor includes a positive portion and a negative portion. The insulative package body partially encloses the capacitors, and the positive portion has a positive lateral surface exposed from a first lateral surface of the insulative package body. The conductive connection layer is electrically connected to the negative portion. The electrode unit includes a first electrode structure and a second electrode structure. The first electrode structure encloses a first portion of the insulative package body and electrically connects to the positive portion, and the second electrode structure encloses a second portion of the insulative package body and electrically connects to the conductive connection layer.


Find Patent Forward Citations

Lin, Chieh. (2023). Capacitor assembly package structure (U.S. Patent No. 11626255). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11626255

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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