The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 17, 2022

Filed:

Jul. 06, 2020
Applicant:

Apaq Technology Co., Ltd., Miaoli County, TW;

Inventor:

Chieh Lin, Hsinchu County, TW;

Assignee:

APAQ TECHNOLOGY CO., LTD., Miaoli County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 9/048 (2006.01); H01G 9/042 (2006.01); H01G 4/002 (2006.01); H01G 9/08 (2006.01); H01G 4/38 (2006.01); H01G 9/15 (2006.01);
U.S. Cl.
CPC ...
H01G 9/048 (2013.01); H01G 4/002 (2013.01); H01G 4/38 (2013.01); H01G 9/042 (2013.01); H01G 9/08 (2013.01); H01G 9/15 (2013.01);
Abstract

A capacitor assembly structure and a method of manufacturing the same are provided. The capacitor assembly structure includes a capacitor unit, an insulative package body, a plurality of positive composite material layers, a conductive connection layer and an electrode unit. The capacitor unit includes a plurality of capacitors each having a positive portion and a negative portion. The insulative package body partially covers the capacitors. A lateral side of the positive portion is exposed from a first lateral surface of the insulative package body. Each positive composite material layer is disposed on the first lateral surface and the lateral side so as to electrically connect to the positive portion. The conductive connection layer is electrically connected to the negative portion. The electrode unit includes a first electrode structure electrically contacting the positive composite material layer and a second electrode structure electrically contacting the conductive connection layer.


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