Tainan, Taiwan

Chun-Chia Huang

This inventor holds 7 USPTO granted patents and 1 published patent application. Top assignee: Apaq Technology Co., Ltd.. Active years: 2012-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chun-Chia Huang. Retrieved from https://idiyas.com/inventor/chun-chia-huang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 7 

% Patents Active = 14.3

Average Co-Inventor Count = 4.3

ph-index = 2

Forward Citations = 4(Granted Patents)


Location History:

  • Xinying, TW (2012)
  • Tainan County, TW (2013 - 2017)

Company Filing History:


Years Active: 2012-2017

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7 patents (USPTO):Explore Patents

Title: Innovations of Chun-Chia Huang

Introduction

Chun-Chia Huang is a prominent inventor based in Tainan County, Taiwan. He has made significant contributions to the field of solid electrolytic capacitors, holding a total of seven patents. His work focuses on enhancing the performance and durability of capacitor technologies.

Latest Patents

One of his latest patents is the "Solid electrolytic capacitor package structure and method of manufacturing the same." This invention provides a solid electrolytic capacitor package structure that includes a capacitor assembly, at least one electrode pin, and a package body that encloses both the capacitor assembly and the electrode pin. The electrode pin features an embedded portion enclosed by the package body and an exposed portion positioned outside of it. The manufacturing method includes a protection step that forms a protecting film on the exposed portion, a coating step that deposits a nanomaterial to form a nanofilm, and a deprotection step that removes the protecting film. This innovation improves the air-tight and water-tight properties of the capacitor package structure, thereby increasing its lifetime.

Another notable patent is the "Stacked solid-state electrolytic capacitor with multi-directional product lead frame structure." This invention consists of a stacked solid-state electrolytic capacitor that includes multiple capacitor units, a substrate unit, and a package unit. The substrate unit features both positive and negative guiding substrates with exposed ends extending in different predetermined directions. The capacitor units are stacked and disposed on the negative guiding substrate, while the package unit encloses the capacitor units and parts of the guiding substrates.

Career Highlights

Chun-Chia Huang is currently employed at Apaq Technology Co., Ltd., where he continues to innovate in the field of capacitor technology. His work has significantly impacted the industry, leading to advancements in the design and functionality of solid electrolytic capacitors.

Collaborations

He collaborates with talented coworkers, including Ching-Feng Lin and Chi-Hao Chiu, who contribute to the innovative projects at Apaq Technology Co., Ltd.

Conclusion

Chun-Chia Huang's contributions to solid electrolytic capacitor technology demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of materials and manufacturing processes, paving the way for future advancements in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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