Apaq Technology Co., Ltd.

Inpaq Technology Co., Ltd.

Ming-Tsung Chen

Ching-Feng Lin

Chi-Hao Chiu

Chieh Lin

Chung-Jui Su

Kun-Huang Chang

Wei-Chih Lee

Shang-Che Lan

Chien-Wei Lin

Chun-Chia Huang

Yi-Ying Wang

Shu-Yu Lin

Yui-Hsin Fran

Cheng-Wei Lai

Chiao-Yinms Yang

Hsi-Dung Lin

Chai-Ching Sung

Yi-Liang Chen

A winding-type capacitor package structure and a method of manufacturing the same are provided. The winding-type capacitor package structure includes a winding assembly, a package assembly and a conductive assembly. The winding assembly includes a winding conductive positive foil and a winding conductive negative foil. The package assembly fully encloses the winding assembly. The conductive assembly includes a first conductive pin and a second conductive pin. The package assembly includes a casing structure, a filling body and a bottom enclosing structure. The casing structure has an accommodating space for receiving the winding assembly. The filling body is filled in the accommodating space for surrounding the winding assembly. The bottom enclosing structure is disposed on a bottom portion of the casing structure for carrying the winding assembly and enclosing the accommodating space. The bottom enclosing structure is surrounded by the casing structure and tightly connected to the filling body.

Winding-type capacitor package structure and method of manufacturing the same

A winding type capacitor assembly with enhanced structural strength and a manufacturing method thereof are provided. The winding type capacitor assembly includes a positive conductive foil, a negative conductive foil, and at least one isolation element. The isolation element is disposed between the positive conductive foil and the negative conductive foil. A conductive polymer dispersed sol and an electrolyte filler are disposed between the positive conductive foil, the negative conductive foil, and the isolation element. The electrolyte filler is at least one selected from one of a conductive composition synthesized by a chemical polymerization method and a resin-blended conductive particle. The winding type capacitor assembly has enhanced structural strength through the use of the electrolyte filler.

Winding type capacitor assembly with enhanced structural strength and method of manufacturing the same

A low leakage electrolytic capacitor includes a winding-type capacitor element, a hybrid electrically conductive medium and a package body. The winding-type capacitor element includes an anode foil, a cathode foil, and a separator interposed between the anode foil and the cathode foil. The hybrid electrically conductive medium is impregnated in the winding-type capacitor element and includes an electrically conductive polymer, an auxiliary polymer, an ion liquid, and a carbon filler. The package body encloses the winding-type capacitor element and the hybrid electrically conductive medium.

Low leakage electrolytic capacitor

The instant disclosure provides a polymer composite material, the method for manufacturing the polymer composite material, a capacitor package structure using the polymer composite material and the method for manufacturing the capacitor package structure. The polymer composite material is used for the cathode of a capacitor, wherein the polymer composite material includes poly(3,4-ethylenedioxythiophene), polystyrene sulfonate and a nanomaterial. Polystyrene sulfonate is connected between the nanomaterial and poly(3,4-ethylenedioxythiophene), and polystyrene sulfonate is bonded to the poly(3,4-ethylenedioxythiophene) through a polymerization process. The content of the nanomaterial ranges from 0.01-1.5 wt. % based on the weight of the polymer composite material.

Polymer composite material, method for manufacturing the polymer composite material, capacitor package structure using the polymer composite material and method for manufacturing the capacitor package structure

The instant disclosure provides a capacitor package structure including a capacitor unit, a first enclosing layer and a second enclosing layer. The capacitor unit includes a capacitor, a first conductive pin and a second conductive pin. The first enclosing layer encloses the entire capacitor, a part of the first conductive pin and a part of the second conductive pin. The second enclosing layer encloses the entire first enclosing layer, a part of the first conductive pin and a part of the second conductive pin. One of the first enclosing layer and the second enclosing layer is a package gel formed by a package material, and another one of the first enclosing layer and the second enclosing layer is a moisture and air resistant film formed by a moisture and air resistant material.

Capacitor package structure

The present disclosure provides a stacked-type solid electrolytic capacitor package structure and a method of manufacturing the same. The capacitor package structure includes a capacitor unit, a solder unit, a package unit and a conductive unit. The capacitor unit includes a plurality of first stacked capacitors. Each first stacked capacitor includes a first positive portion and a first negative portion. The first positive portion has at least one first through hole. The first through holes of the first positive portions are in communication with each other to form a first communication hole. The solder unit includes a first connection solder for filling the first communication hole so as to connect the first positive portions with each other. The package unit includes a package body for enclosing the capacitor unit and the solder unit. The conductive unit includes a first conductive terminal and a second conductive terminal.

Stacked-type solid electrolytic capacitor package structure and method of manufacturing the same

The present disclosure provides a capacitor assembly having a non-symmetrical electrode structure and a capacitor seat structure thereof. The capacitor assembly includes a capacitor seat structure and a capacitor package structure. The capacitor seat structure includes a capacitor seat, a first electrode layer and a second electrode layer. The capacitor seat has a first through hole, a first groove, a second through hole and a second groove. The capacitor package structure includes a first conductive pin and a second conductive pin. The first conductive pin passes through the first through hole and is disposed inside the first groove to electrically contact the first electrode layer. The second conductive pin passes through the second through hole and is disposed inside the second groove to electrically contact the second electrode layer.

Capacitor assembly having a non-symmetrical electrode structure and capacitor seat structure thereof

The instant disclosure relates to a manufacturing method of capacitor cathode foil structure, comprising the following steps. The first step is providing a base foil, subsequently inserting the foil into a reactor. The next step is executing a heating process for heat the base foil to a temperature region of 400&#xb0; C. to 1000&#xb0; C. The next step is directing a carbon containing precursor gas into the reactor. The last step is executing a cooling process for cooling the base foil to a temperature below 100&#xb0; C. to deposit a graphene-based layer on one surface of the base foil, wherein the graphene-based layer is consisted of a plurality of graphene-based thin films in stacked arrangement.

Capacitor cathode foil structure and manufacturing method thereof

The instant disclosure relates to a stacked-type solid electrolytic capacitor capable of increasing welding effect and a manufacturing method of the same. The stacked-type solid electrolytic capacitor includes a plurality of solid electrolytic capacitor units, each of which has an anode part and a cathode part connected to the anode part, characterized in that the anode part is formed with at least one buffering via-hole in a welding area thereof. When each of the anode parts is compressed in a welding process, the volume of the corresponding buffering via-hole decreases accordingly. Therefore, the soldering performance of the anode part solid electrolytic capacitor is enhanced and the connection stability is increased.

Stacked-type solid electrolytic capacitor capable of increasing welding effect and manufacturing method of the same

The present disclosure provides a solid electrolytic capacitor package structure for increasing electrical performances and a method of manufacturing the same, and a capacitor unit thereof. The capacitor unit includes at least one first capacitor, the at least one first capacitor includes a conductive polymer composite material layer. The conductive polymer composite material layer includes a conductive polymer material and a first nanometer material mixed with the conductive polymer material, and the first nanometer material includes a plurality of first fully embedded nanometer structures completely enclosed by the conductive polymer material and a plurality of first partially exposed nanometer structures partially exposed from the conductive polymer material.

Solid electrolytic capacitor package structure for increasing electrical performances and method of manufacturing the same, and capacitor unit thereof

The instant disclosure relates to a method for making solid electrolytic capacitor package structure with improved conductive terminals. The first step is to provide at least one conductive terminal having an electrical contact portion and a lead-out portion. The next step is to remove a portion of mantle layer from the surface of the core layer of at least one conductive terminal by a dry-type process. The next step is to sequentially stack together a plurality of stacked-type capacitors to form a capacitor unit and then electrically connect the capacitor unit to at least one conductive terminal. The next step is to form a package body to encapsulate the capacitor unit and the electrical contact portion of at least one conductive terminal. The last step is to bend the lead-out portion of at least one conductive terminal to an axis that extends along the surface of the package body.

Method for making solid electrolytic capacitor package structure with improved conductive terminals

The instant disclosure relates to a solid electrolytic capacitor with improved metallic anode and a method for manufacturing the same. The solid electrolytic capacitor includes a substrate layer, a conductive polymer layer and an electrode layer. The substrate layer has a cathode portion and an anode portion having a smaller thickness than the cathode portion. The conductive polymer layer is formed to cover the cathode portion of the substrate layer. The electrode layer is formed to cover the conductive polymer layer. Therefore, the instant solid electrolytic capacitor can be applied to a packing process, and welding success yield rate can be improved.

Solid-state electrolytic capacitor with improved metallic anode and method for manufacturing the same

A sealing element of the instant disclosure includes a cover body, an exterior convex portion, and an interior convex portion. The cover body has a first surface, a second surface arranged opposite to the first surface, and a pair of terminal holes formed on the cover body and extending through the first and second surfaces. The exterior convex portion has at least one first abutting surface arranged on the first surface of the cover body and an expansion space formed concavely in the exterior convex portion. The interior convex portion has at least one second abutting surface arranged on the second surface of the cover body. Specifically, the sealing element is configured to prevent the capacitor element from swaying, so that the electrical property of the wound-type solid state electrolytic capacitor with the sealing element can be improved.

Sealing element and wound-type solid state electrolytic capacitor thereof

A solid electrolytic chip capacitor is provided which comprises a substrate layer, an electrical insulating block, a conductive polymer layer, a patterned reinforcement layer, and an electrode layer. The electrical insulating block is formed on the substrate layer to define an anode region and a cathode region on the substrate layer. The conductive polymer layer is formed to cover the cathode region of the substrate layer. The patterned reinforcement layer is formed to cover the conductive polymer. The electrode layer is formed to cover the patterned reinforcement layer. Whereby, the mechanical strength of the chip solid electrolytic capacitor can be improved without loss of capacitance.

Solid electrolytic chip capacitor and manufacturing method thereof

The instant disclosure relates to an improved method for the production of solid electrolytic capacitor, comprising the following steps. First, provide an insulating substrate. Next, form a plurality of conducting gels including aluminum powder on the insulating substrate. Thirdly, execute a high-temperature sintering process to metalize the conducting gels to form a plurality of aluminum plates. Next, form a dielectric layer on every aluminum plate. Then form an isolation layer on every dielectric layer to define an anodic region and a cathodic region. Lastly, form a conductive layer on the dielectric layer of every cathodic region, thus defining a solid electrolytic capacitor unit.

Growing community of inventors

Changhua County, Taiwan

Ming-Tsung Chen