The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 2019

Filed:

Nov. 27, 2017
Applicant:

Apaq Technology Co., Ltd., Miaoli County, TW;

Inventors:

Shang-Che Lan, Kaohsiung, TW;

Yi-Liang Chen, Changhua County, TW;

Ming-Tsung Chen, Changhua County, TW;

Assignee:

APAQ TECHNOLOGY CO., LTD., Miaoli County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 9/08 (2006.01); H01G 4/33 (2006.01); H01G 2/10 (2006.01); H01G 2/12 (2006.01);
U.S. Cl.
CPC ...
H01G 4/33 (2013.01); H01G 2/103 (2013.01); H01G 2/12 (2013.01); H01G 9/08 (2013.01);
Abstract

The instant disclosure provides a capacitor package structure including a capacitor unit, a first enclosing layer and a second enclosing layer. The capacitor unit includes a capacitor, a first conductive pin and a second conductive pin. The first enclosing layer encloses the entire capacitor, a part of the first conductive pin and a part of the second conductive pin. The second enclosing layer encloses the entire first enclosing layer, a part of the first conductive pin and a part of the second conductive pin. One of the first enclosing layer and the second enclosing layer is a package gel formed by a package material, and another one of the first enclosing layer and the second enclosing layer is a moisture and air resistant film formed by a moisture and air resistant material.


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