The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2019
Filed:
Jul. 10, 2017
Apaq Technology Co., Ltd., Miaoli County, TW;
Chien-Wei Lin, Miaoli County, TW;
Shang-Che Lan, Kaohsiung, TW;
Ming-Tsung Chen, Changhua County, TW;
APAQ TECHNOLOGY CO., LTD., Miaoli County, TW;
Abstract
The present disclosure provides a stacked-type solid electrolytic capacitor package structure and a method of manufacturing the same. The capacitor package structure includes a capacitor unit, a solder unit, a package unit and a conductive unit. The capacitor unit includes a plurality of first stacked capacitors. Each first stacked capacitor includes a first positive portion and a first negative portion. The first positive portion has at least one first through hole. The first through holes of the first positive portions are in communication with each other to form a first communication hole. The solder unit includes a first connection solder for filling the first communication hole so as to connect the first positive portions with each other. The package unit includes a package body for enclosing the capacitor unit and the solder unit. The conductive unit includes a first conductive terminal and a second conductive terminal.