Miaoli, Taiwan

Ming-Hung Tseng

This inventor holds 23 USPTO granted patents and 10 published patent applications, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2007-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ming-Hung Tseng. Retrieved from https://idiyas.com/inventor/ming-hung-tseng-fzw9d6fz

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 23 

% Patents Active = 91.3

Average Co-Inventor Count = 5.7

ph-index = 3

Forward Citations = 25(Granted Patents)


Location History:

  • Miaoli, TW (2007)
  • Toufen Township, Miaoli County, TW (2018 - 2023)
  • Toufen Township, TW (2020 - 2023)
  • Miaoli County, TW (2020 - 2024)

Company Filing History:


Years Active: 2007-2026

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Areas of Expertise:
Integrated Fan-Out Package
Semiconductor Device
Wireless Charging
Package Structure
Fabrication Method
Semiconductor Structure
Manufacturing Method
Dual-Mode Device
Piezoelectric Transducer
Packaged Devices
Thermal Management
3D Stacking
23 patents (USPTO):Explore Patents

Title: The Innovations of Inventor Ming-Hung Tseng

Introduction: Ming-Hung Tseng, an accomplished inventor from Miaoli County, Taiwan, has made significant contributions to the field of semiconductor technology. With a remarkable portfolio of 17 patents, his work has impacted the industry and led to advancements in semiconductor packaging and manufacturing processes.

Latest Patents: Among his most recent innovations is a patent for a method of fabricating semiconductor packages. This innovative package includes a first semiconductor die, a second semiconductor die, an insulating encapsulation, a dielectric layer structure, a conductor structure, and a second insulating encapsulation. The design incorporates a through substrate via (TSV) that extends through the semiconductor substrate, optimizing connectivity and efficiency in semiconductor devices. Another notable patent focuses on a semiconductor package development that includes various structures such as a redistribution structure and an encapsulating material, showcasing his expertise in creating advanced semiconductor solutions.

Career Highlights: Ming-Hung Tseng is currently affiliated with Taiwan Semiconductor Manufacturing Company Limited, a prominent organization in the semiconductor industry. His role involves leading efforts in innovative packaging techniques and enhancing manufacturing methodologies, which have been crucial in keeping the company at the forefront of technology.

Collaborations: Throughout his career, Tseng has collaborated with talented individuals like Hao-Yi Tsai and Tzu-Sung Huang, contributing to a rich environment of creativity and innovation. These partnerships have further fueled advancements in semiconductor technologies, resulting in patents that address the industry's evolving challenges.

Conclusion: Ming-Hung Tseng stands out as a leading inventor in the semiconductor field, with a strong record of patents that highlight his ingenuity and dedication to innovation. His contributions continue to shape the evolution of semiconductor technology, making him a key figure in this dynamic industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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