logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11251644 B1

PDFFull Text
Date of Patent:
Feb. 15, 2022

Filed:

May. 06, 2020

Packaged semiconductor devices with wireless charging means

Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Chen-Hua Yu, Hsinchu, TW;

Hao-Yi Tsai, Hsinchu, TW;

Tzu-Sung Huang, Tainan, TW;

Ming-Hung Tseng, Toufen Township, TW;

Hung-Yi Kuo, Taipei, TW;

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD, Hsinchu, TW;

Attorney:

McClure, Qualey & Rodack, LLP

Primary Examiner:

Matthew E Warren

Int. Cl.
CPC ...
H02J 7/02 (2016.01); H01L 21/3205 (2006.01); H01L 23/522 (2006.01); H01L 23/64 (2006.01); H01L 23/10 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H02J 7/00 (2006.01); H02J 50/10 (2016.01); H04B 5/00 (2006.01); H01F 38/14 (2006.01); H01F 27/36 (2006.01);
U.S. Cl.
CPC ...
H02J 7/025 (2013.01); H01F 27/36 (2013.01); H01F 38/14 (2013.01); H01L 21/32051 (2013.01); H01L 23/10 (2013.01); H01L 23/3121 (2013.01); H01L 23/49822 (2013.01); H01L 23/5227 (2013.01); H01L 23/5389 (2013.01); H01L 23/645 (2013.01); H02J 7/0042 (2013.01); H02J 50/10 (2016.02); H04B 5/0037 (2013.01); H04B 5/0075 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/19 (2013.01); H01L 2224/73267 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19105 (2013.01);
Abstract

A semiconductor device package is provided, including a semiconductor device, a molding material, and a conductive slot. The molding material surrounds the semiconductor device. The conductive slot is positioned over the molding material and having an opening and at least two channels connecting the opening to the edges of the conductive slot.

Find Patent Forward Citations

Quick Actions:

Yu, Chen-Hua. (2022). Packaged semiconductor devices with wireless charging means (U.S. Patent No. 11251644). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11251644

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…