Hsinchu, Taiwan

Min-Jer Wang

USPTO Granted Patents = 6 

Average Co-Inventor Count = 4.3

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2017-2022

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6 patents (USPTO):Explore Patents

Title: Unveiling the Innovations of Inventor Min-Jer Wang

Introduction:

Inventor Min-Jer Wang, a distinguished figure in the tech industry, hails from Hsinchu, Taiwan. With an impressive portfolio of 6 patents to his name, Wang has been pivotal in driving cutting-edge advancements in integrated circuits and testing methodologies.

Latest Patents:

1. "Composite integrated circuits and methods for wireless interactions therewith": Wang's groundbreaking invention revolves around an integrated circuit featuring wireless power transfer (WPT) technology. This innovation enables the extraction of energy from electromagnetic signals to power tracking circuits, enhancing the efficiency of wireless interactions.

2. "Bump ball testing system and method": Wang's expertise shines through in this patent, which introduces an integrated circuit testing system with a unique approach to testing electrical connectivity. By strategically utilizing conductive structures and test circuits, this invention optimizes the assessment of integrated circuits.

Career Highlights:

Having made significant contributions to the field of semiconductor technology, Min-Jer Wang is associated with the prestigious Taiwan Semiconductor Manufacturing Company Limited (TSMC). As a key player in TSMC's research and development team, Wang continues to spearhead innovation in chip design and testing methodologies.

Collaborations:

Throughout his career, Min-Jer Wang has collaborated closely with esteemed colleagues such as Chewn-Pu Jou and Ching-Nen Peng. Together, they have synergized their skills and expertise to drive forward multifaceted projects, fostering a culture of innovation and excellence.

Conclusion:

In conclusion, Min-Jer Wang's inventive prowess and dedication to technological advancement have left an indelible mark on the semiconductor industry. His work exemplifies a commitment to pushing boundaries, redefining possibilities, and shaping the future of integrated circuits.

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