IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10164480 B1

PDFFull Text
Date of Patent:
Dec. 25, 2018

Filed:

May. 08, 2017

Composite integrated circuits and methods for wireless interactions therewith

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Min-Jer Wang, Hsinchu, TW;

Ching-Nen Peng, Hsinchu, TW;

Chewn-Pu Jou, Hsinchu, TW;

Feng Wei Kuo, Zhudong Township, TW;

Hao Chen, New Taipei, TW;

Hung-Chih Lin, New Taipei, TW;

Huan-Neng Chen, Taichung, TW;

Kuang-Kai Yen, Kaohsiung, TW;

Ming-Chieh Liu, Longtan Township, TW;

Tsung-Hsiung Lee, New Taipei, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Attorney:

Haynes and Boone, LLP

Primary Examiner:

Christine T Tu

Int. Cl.
CPC ...
G06F 11/00 (2006.01); G01R 31/28 (2006.01); H02J 50/40 (2016.01); H01L 25/065 (2006.01); H01L 23/538 (2006.01); H02J 50/10 (2016.01); H02J 50/80 (2016.01); G01R 31/302 (2006.01); G06F 17/50 (2006.01); H01L 23/544 (2006.01); H02J 5/00 (2016.01); H02J 50/20 (2016.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H02J 50/40 (2016.02); G01R 31/2856 (2013.01); G01R 31/2884 (2013.01); G01R 31/2889 (2013.01); G01R 31/3025 (2013.01); G06F 17/5068 (2013.01); H01L 23/538 (2013.01); H01L 23/544 (2013.01); H01L 25/0652 (2013.01); H02J 5/005 (2013.01); H02J 50/10 (2016.02); H02J 50/20 (2016.02); H02J 50/80 (2016.02); H01L 24/16 (2013.01); H01L 25/0655 (2013.01); H01L 25/0657 (2013.01); H01L 2223/54446 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/14181 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16148 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/94 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06565 (2013.01); H01L 2225/06596 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15311 (2013.01);
Abstract

An integrated circuit (IC) includes a first circuit layer that includes a first wireless power transfer (WPT) device, a first chip electrically connected to the first circuit layer, and a first tracking circuit disposed in the first chip. The first WPT device may be configured to extract energy from an electromagnetic signal and provide an output voltage. The first tracking circuit may be powered by the output voltage of the first WPT device and may output tracking data in response to an instruction extracted from the electromagnetic signal.

Find Patent Forward Citations

Loading…