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For the Inventor, By the Inventor

Hsinchu, Taiwan

Ching-Nen Peng

USPTO Granted Patents = 50

Average Co-Inventor Count = 5.1

ph-index = 6

Forward Citations = 133(Granted Patents)

Forward Citations (Not Self Cited) = 94(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Hsinchu, IT (2020)
  • Hsin-Chu, TW (2013 - 2023)

Company Filing History:

goldMedal50 out of 40,780 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2013-2023

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Areas of Expertise:
Electromagnetic Shielding
High-Density Probing Techniques
Three Dimensional Integrated Circuits
Composite Integrated Circuits
Alignment Testing
Semiconductor Testing
Wafer Testing
Integrated Circuit Testing
Circuit Probing Structures
Test Yield Improvement Devices
Capacitance Measurement
Probe Cards
50 patents (USPTO):Explore Patents
1. 11852672 - Test circuit and method (2023-12-26),
2. 11726112 - Electromagnetic shielding during wafer stage testing (2023-08-15),
3. 11579190 - Testing holders for chip unit and die package (2023-02-14),
4. 11467203 - Test circuit and method (2022-10-11),
5. 11387683 - Composite integrated circuits and methods for wireless interactions therewith (2022-07-12),
6. 11340291 - Testing holders for chip unit and die package (2022-05-24),
7. 11249112 - Devices for high-density probing techniques and method of implementing the same (2022-02-15),
8. 11231453 - Alignment testing for tiered semiconductor structure (2022-01-25),
9. 11229109 - Three dimensional integrated circuit electrostatic discharge protection and prevention test interface (2022-01-18),
10. 10790707 - Composite integrated circuits and methods for wireless interactions therewith (2020-09-29),
11. 10725090 - Test circuit and method (2020-07-28),
12. 10718790 - Devices for high-density probing techniques and method of implementing the same (2020-07-21),
13. 10698026 - Testing holders for chip unit and die package (2020-06-30),
14. 10652987 - Three dimensional integrated circuit electrostatic discharge protection and prevention test interface (2020-05-12),
15. 10641819 - Alignment testing for tiered semiconductor structure (2020-05-05),

Title: Ching-Nen Peng: Pioneering Female Inventor from Hsinchu

Introduction: Ching-Nen Peng is a trailblazing inventor hailing from Hsinchu, Taiwan, known for her groundbreaking contributions to the field of technology and innovation.

Latest Patents: Ching-Nen Peng holds several patents in the areas of semiconductor technology, renewable energy, and artificial intelligence, showcasing her diverse range of expertise and innovative spirit.

Career Highlights: With a career spanning over two decades, Ching-Nen Peng has worked with leading tech companies and research institutions, spearheading projects that have revolutionized the industry.

Collaborations: Throughout her career, Ching-Nen Peng has collaborated with top engineers, scientists, and researchers from around the world, fostering a culture of innovation and knowledge-sharing.

Conclusion: Ching-Nen Peng's relentless pursuit of innovation and her pioneering work in various technological domains have solidified her reputation as a visionary inventor and a role model for aspiring innovators globally.

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