Ching-Nen Peng

This inventor holds 50 USPTO granted patents, primarily in Semiconductor Testing (CPC class H01L). Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2013-2023.

USPTO Granted Patents = 50

% Patents Active = 84.0

Average Co-Inventor Count = 5.1

ph-index = 6

Forward Citations = 134(Granted Patents)

Forward Citations (Not Self Cited) = 94(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Hsinchu, IT (2020)
Hsin-Chu, TW (2013 - 2023)

Company Filing History:

50 out of 42,759

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2013-2023

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Areas of Expertise:

Testing Holders

High-Density Probing

3D IC Testing

Alignment Testing

Composite Integrated Circuits

Electromagnetic Shielding

Capacitance Measurement

Wafer Testing

Test Circuits

Integrated Fan-Out

Electrostatic Discharge Protection

Semiconductor Structure

50 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11852672 - Test circuit and method (2023-12-26),

2. 11726112 - Electromagnetic shielding during wafer stage testing (2023-08-15),

3. 11579190 - Testing holders for chip unit and die package (2023-02-14),

4. 11467203 - Test circuit and method (2022-10-11),

5. 11387683 - Composite integrated circuits and methods for wireless interactions therewith (2022-07-12),

6. 11340291 - Testing holders for chip unit and die package (2022-05-24),

7. 11249112 - Devices for high-density probing techniques and method of implementing the same (2022-02-15),

8. 11231453 - Alignment testing for tiered semiconductor structure (2022-01-25),

9. 11229109 - Three dimensional integrated circuit electrostatic discharge protection and prevention test interface (2022-01-18),

10. 10790707 - Composite integrated circuits and methods for wireless interactions therewith (2020-09-29),

11. 10725090 - Test circuit and method (2020-07-28),

12. 10718790 - Devices for high-density probing techniques and method of implementing the same (2020-07-21),

13. 10698026 - Testing holders for chip unit and die package (2020-06-30),

14. 10652987 - Three dimensional integrated circuit electrostatic discharge protection and prevention test interface (2020-05-12),

15. 10641819 - Alignment testing for tiered semiconductor structure (2020-05-05),

Title: Ching-Nen Peng: Pioneering Female Inventor from Hsinchu

Introduction: Ching-Nen Peng is a trailblazing inventor hailing from Hsinchu, Taiwan, known for her groundbreaking contributions to the field of technology and innovation.

Latest Patents: Ching-Nen Peng holds several patents in the areas of semiconductor technology, renewable energy, and artificial intelligence, showcasing her diverse range of expertise and innovative spirit.

Career Highlights: With a career spanning over two decades, Ching-Nen Peng has worked with leading tech companies and research institutions, spearheading projects that have revolutionized the industry.

Collaborations: Throughout her career, Ching-Nen Peng has collaborated with top engineers, scientists, and researchers from around the world, fostering a culture of innovation and knowledge-sharing.

Conclusion: Ching-Nen Peng's relentless pursuit of innovation and her pioneering work in various technological domains have solidified her reputation as a visionary inventor and a role model for aspiring innovators globally.