Hsinchu, Taiwan

Hung-Chih Lin

This inventor holds 91 USPTO granted patents and 8 published patent applications and 5 EPO patents, primarily in Semiconductor Testing (CPC class H04N19-597). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Mediatek Corporation, Young Lighting Technology Corporation. Active years: 2008-2026.

USPTO Granted Patents = 91 

% Patents Active = 85.7

 

Average Co-Inventor Count = 4.5

ph-index = 8

Forward Citations = 204(Granted Patents)

Forward Citations (Not Self Cited) = 146(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Yunlin County, TW (2018 - 2019)
  • Nantou County, TW (2019 - 2020)
  • Caotun Township, Nantou County, TW (2019 - 2021)
  • New Taipei, TW (2018 - 2022)
  • Hsin-Chu, TW (2008 - 2023)

Company Filing History:


Years Active: 2008-2026

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Areas of Expertise:
Test Circuit
Probing Structure
High-Density Probing
360-Degree Projection
Electrostatic Discharge Protection
Virtual Reality
Image Compression
Cubic-Face Frames
Alignment Testing
Integrated Circuits
Wireless Interactions
Testing Apparatus
91 patents (USPTO):Explore Patents

Title: Innovations of Hung-Chih Lin in Semiconductor Testing

Introduction

Hung-Chih Lin is an esteemed inventor based in Hsinchu, Taiwan, with a remarkable portfolio of 90 patents to his name. His contributions primarily focus on innovations in semiconductor testing methodologies and equipment. Lin's expertise is evident in his recent patents that enhance the efficiency and effectiveness of testing integrated circuits.

Latest Patents

Among his latest creations is a patent for a "Test Circuit and Method." This involves a systematic approach wherein dies are situated on a test fixture. Each die comprises first antennas and at least one via array, designed to space apart the antennas. Through coordinated testing processes, the first antennas interact with second antennas corresponding to an under-test device. This method improves the testing procedures significantly.

Another notable patent is centered around a "Test Probing Structure." This invention caters to wafer-level testing of semiconductor integrated circuit packaged devices (DUT). The structure includes a substrate embedded with through-substrate vias and a bump array on its first surface for engagement with a probe card. The probing unit on the substrate’s second surface incorporates a conductive probe pad and interconnected microbumps. This configuration allows for testing via the bump and microbump arrays without directly probing the DUT microbumps, streamlining the testing process.

Career Highlights

Hung-Chih Lin has held significant roles at prominent companies such as Taiwan Semiconductor Manufacturing Company and MediaTek Corporation. His work at these firms has played a crucial role in advancing semiconductor technologies and testing methodologies.

Collaborations

Lin has collaborated with notable professionals in his field, including Mill-Jer Wang and Ching-Nen Peng. These partnerships have fostered innovative solutions and have contributed to Lin's impactful career in semiconductor research and development.

Conclusion

Hung-Chih Lin continues to be a pivotal figure in the semiconductor industry. His innovative patents and collaborative efforts reflect his dedication to improving testing methodologies in semiconductor technology. With a solid foundation of experience and continuous innovation, Lin remains a significant contributor to advancements in this ever-evolving field.

Profile summary based on public USPTO records.
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