Taiwan Semiconductor Manufacturing Comp. Ltd.

Min-Jer Wang

Chewn-Pu Jou

Huan-Neng Chen

Feng Wei Kuo

Hung-Chih Lin

Hao Chen

Ching-Nen Peng

Kuang-Kai Yen

Tsung-Hsiung Lee

Ming-Chieh Liu

An integrated circuit (IC) includes a first circuit layer that includes a first wireless power transfer (WPT) device, a first chip electrically connected to the first circuit layer, and a first tracking circuit disposed in the first chip. The first WPT device may be configured to extract energy from an electromagnetic signal and provide an output voltage. The first tracking circuit may be powered by the output voltage of the first WPT device and may output tracking data in response to an instruction extracted from the electromagnetic signal.

Composite integrated circuits and methods for wireless interactions therewith

An integrated circuit testing system is provided that includes a conductive line connected to a node configured to have a ground voltage. A plurality of conductive structures are coupled to the conductive line. A plurality of test circuits each is configured to supply a test voltage individually to a different conductive structure of the plurality of conductive structures for testing electrical connectivity of each of the different conductive structures. The conductive line is positioned between the node and the test circuits of the plurality of test circuits. A controller is coupled to each of the test circuits of the plurality of test circuits. The controller is configured to cause each of the test circuits of the plurality of test circuits to individually supply the test voltage to each of the different conductive structures of the plurality of conductive structures.

Bump ball testing system and method

An integrated circuit testing system includes a conductive structure, a conductive pad electrically connected with the conductive structure, a test circuit electrically connected with the conductive pad, a conductive line electrically connected with the conductive structure, the conductive line being configured to be connected with a ground, and a controller coupled with the test circuit. The controller is configured to selectively cause the test circuit to supply a voltage to the conductive structure via the conductive pad. The test circuit is configured to provide feedback to the controller indicative of whether the conductive structure is electrically connected with the conductive pad.

A composite integrated circuit (IC) includes a first circuit layer, a second circuit layer having a first chip and a second chip, and a first wireless power transfer (WPT) device in the first chip or the first circuit layer. The first WPT device generates a power supply voltage by extracting energy from an electromagnetic signal. A first tracking circuit in the second chip or the first circuit layer is powered by the power supply voltage from the first WPT device and stores or outputs tracking data in response to an instruction extracted from the electromagnetic signal.

Growing community of inventors

Hsinchu, Taiwan

Min-Jer Wang