The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 16, 2017
Filed:
Jul. 20, 2015
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Min-Jer Wang, Hsinchu, TW;
Ching-Nen Peng, Hsinchu, TW;
Chewn-Pu Jou, Hsinchu, TW;
Feng Wei Kuo, Zhudong Township, TW;
Hao Chen, New Taipei, TW;
Hung-Chih Lin, Hsinchu, TW;
Huan-Neng Chen, Taichung, TW;
Kuang-Kai Yen, Kaohsiung, TW;
Ming-Chieh Liu, Longtan Township, TW;
Tsung-Hsiung Lee, New Taipei, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
A composite integrated circuit (IC) includes a first circuit layer, a second circuit layer having a first chip and a second chip, and a first wireless power transfer (WPT) device in the first chip or the first circuit layer. The first WPT device generates a power supply voltage by extracting energy from an electromagnetic signal. A first tracking circuit in the second chip or the first circuit layer is powered by the power supply voltage from the first WPT device and stores or outputs tracking data in response to an instruction extracted from the electromagnetic signal.