Min Chul Shin

Title: Min Chul Shin: Innovator in Semiconductor Packaging

Introduction

Min Chul Shin is a prominent inventor based in Bucheon-si, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of 6 patents. His work focuses on innovative methods and designs that enhance the efficiency and functionality of semiconductor devices.

Latest Patents

One of Min Chul Shin's latest patents is titled "Semiconductor package and manufacturing method thereof." This patent describes a semiconductor package that includes a substrate with a first surface and a second surface opposite to the first surface. The design features at least one first recess portion formed in a direction from the first surface toward the second surface. Additionally, it incorporates a plurality of first recess conductive patterns formed in the first recess portion, along with a first passive element inserted into the first recess portion of the substrate. This passive element has a first electrode and a second electrode that are electrically connected to the plurality of first recess conductive patterns.

Career Highlights

Throughout his career, Min Chul Shin has worked with notable companies in the semiconductor industry, including Amkor Technology, Inc. and Amkor Technology Singapore Holding Pte. Ltd. His experience in these organizations has allowed him to develop and refine his expertise in semiconductor packaging technologies.

Collaborations

Min Chul Shin has collaborated with several professionals in his field, including Byong Jin Kim and Jae Ung Lee. These collaborations have contributed to the advancement of semiconductor packaging innovations.

Conclusion

Min Chul Shin is a distinguished inventor whose work in semiconductor packaging has led to several patents and advancements in the industry. His contributions continue to influence the development of efficient semiconductor technologies.