The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2013
Filed:
Feb. 18, 2010
Applicants:
Byong Jin Kim, Kyunggi-Do, KR;
Min Chul Shin, Gwangju Si, KR;
Ho Choi, Gwangju Si, KR;
Inventors:
Assignee:
Amkor Technology, Inc., Chandler, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 21/44 (2006.01); B23K 31/00 (2006.01); B23K 31/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor device has a substrate having a plurality of conductive pads formed thereon. A semiconductor die is provided having a plurality of conductive pillars formed thereon. A solder is used for electrically coupling the conductive pillars to the conductive pads. Solder mask is formed on portions of the conductive pads to prevent the solder from flowing in an unwanted direction on the conductive pads.