Amkor Technology, Inc.

Amkor Technology Singapore Holding Pte. Ltd.

Min Chul Shin

Byong Jin Kim

Ji Hyun Kim

Jae Ung Lee

Yung Woo Lee

Dong Hyun Bang

EunNaRa Cho

Wook Choi

Ho Jeong Lim

Chang Hun Kim

KooWoong Jeong

Ho Choi

Tae Yong Lee

Kyoung Yeon Lee

Se Man Oh

A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises a substrate having a first surface and a second surface opposite to the first surface, and comprising at least one first recess portion formed in a direction ranging from the first surface toward the second surface, a plurality of first recess conductive patterns formed in the first recess portion, and a first passive element inserted into the first recess portion of the substrate and having a first electrode and a second electrode electrically connected to the plurality of first recess conductive patterns.

Semiconductor package and manufacturing method thereof

Provided are a semiconductor package and a manufacturing method thereof for securing a space for mounting a semiconductor device by etching a temporary metal plate to form a plurality of conductive posts.

Methods and devices for a semiconductor device having conductive pads to prevent solder reflow are disclosed and may include a substrate comprising conductive pads of rectangular shape and neck-down portions on opposite sides of the rectangular shape, a semiconductor die comprising conductive pillars, and a solder electrically coupling the conductive pillars to the conductive pads. The neck-down portions may comprise a solder mask for the conductive pads to prevent solder from flowing in an unwanted direction on the conductive pads. The conductive pillars may comprise an elliptical cross-section with a minor axis length X and a major axis length Y. The major axis of the elliptical cross-section may be parallel to a long axis of the rectangular shape of the conductive pads. A decrease (W) in width of the conductive pads from the rectangular shape to the neck-down portions may be defined by X/5&#x2266;W&#x2266;X/2.

Semiconductor device having conductive pads with neck-down portions to prevent solder reflow

A semiconductor device has a substrate having a plurality of conductive pads formed thereon. A semiconductor die is provided having a plurality of conductive pillars formed thereon. A solder is used for electrically coupling the conductive pillars to the conductive pads. Solder mask is formed on portions of the conductive pads to prevent the solder from flowing in an unwanted direction on the conductive pads.

Semiconductor device having conductive pads to prevent solder reflow

Growing community of inventors

Bucheon-si, South Korea

Min Chul Shin