This inventor holds 11 USPTO granted patents. Top assignees: International Business Machines Corporation, Kollmorgen Corporation, Intel Corporation. Active years: 1981-2005.
Company Filing History:
7 out of 166,209 
2 out of 124 
1 out of 56,222 
Years Active: 1981-2005
Title: **Milan Paunovic: Innovator in Interconnection Structures**
Introduction
Milan Paunovic is a renowned inventor based in Port Washington, NY, with an impressive portfolio of 11 patents. His innovative work primarily focuses on interconnection structures used in electronic devices, showcasing his expertise in materials and fabrication techniques.
Latest Patents
Among his latest contributions, Paunovic has developed a **Structure comprising an interlayer of palladium and/or platinum and method for fabrication thereof**. This patent describes an interconnection structure that includes a substrate with a dielectric layer, a barrier layer in the via opening, and an interlayer of palladium and/or platinum topped with a layer of copper or copper alloy. Another significant patent, **Method for depositing copper onto a barrier layer**, details a process where copper is deposited onto a tungsten barrier layer using an electroless copper plating bath with a specific pH level and controlled deposition rate.
Career Highlights
Throughout his career, Milan Paunovic has made substantial contributions while working with prestigious companies. Notably, he served at **IBM** (International Business Machines Corporation) and **Kollmorgen Corporation**, where he utilized his skills to advance technology in interconnectivity and materials science.
Collaborations
Milan has collaborated with notable industry professionals such as Panayotis Constantinou Andricacos and Christopher Vincent Jahnes. These teamwork experiences have undoubtedly enriched his innovative approaches and led to significant advancements in his field.
Conclusion
With a strong foundation in engineering and a substantial number of patents to his name, Milan Paunovic continues to influence the landscape of electronic interconnections. His inventive spirit and commitment to innovation demonstrate the vital role that inventors play in shaping technology for the future.