The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 13, 1990
Filed:
Apr. 29, 1988
Rowan Hughes, Bedford, OH (US);
Milan Paunovic, Port Washington, NY (US);
Rudolph J Zeblisky, Hauppauge, NY (US);
Kollmorgen Corporation, Simsbury, CT (US);
Abstract
Electroless metal plating solutions are formulated and controlled to provide high quality metal deposits by establishing the intrinsic cathodic reaction rate of the solution less than 110% of the intrinsic anodic reaction rate. Methods are provided to formulate electroless copper plating solutions which can deposit copper on printed wiring boards of quality sufficient to pass a thermal stress of 10 seconds contact with molten solder at 288.degree. C. without cracking the copper deposits on the surface of the printed wiring boards or in the holes. The ratio of the anodic reaction rate to the cathodic reaction rate can be determined by electrochemical measurements, or it can be estimated by varying the concentration of the reactants and measuring the plating rates.