This inventor holds 1 USPTO granted patent. Top assignee: Kollmorgen Corporation. Active years: 1990.
Company Filing History:
Years Active: 1990
Title: Innovations of Rowan Hughes in Electroless Metal Plating
Introduction
Rowan Hughes is an accomplished inventor based in Bedford, OH (US). He has made significant contributions to the field of electroless metal plating, particularly in the production of high-quality copper deposits on substrates. His innovative methods have the potential to enhance the reliability of printed wiring boards.
Latest Patents
Rowan Hughes holds a patent for a method of consistently producing a copper deposit on a substrate. This patent outlines a process where electroless metal plating solutions are formulated and controlled to ensure high-quality metal deposits. The intrinsic cathodic reaction rate of the solution is maintained at less than 110% of the intrinsic anodic reaction rate. This method allows for the deposition of copper on printed wiring boards that can withstand thermal stress without cracking.
Career Highlights
Hughes is currently employed at Kollmorgen Corporation, where he applies his expertise in electroless plating. His work focuses on developing solutions that meet stringent quality standards for electronic components. With a patent portfolio that includes 1 patent, he has established himself as a key figure in his field.
Collaborations
Rowan has collaborated with notable colleagues such as Milan Paunovic and Rudolph J Zeblisky. Their combined efforts have contributed to advancements in metal plating technologies.
Conclusion
Rowan Hughes is a pioneering inventor whose work in electroless metal plating has the potential to revolutionize the production of printed wiring boards. His innovative methods and dedication to quality continue to influence the industry.