The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2002
Filed:
Oct. 07, 1999
Panayotis Andricacos, Croton-on-Hudson, NY (US);
James E. Fluegel, Tivoli, NY (US);
John G. Gaudiello, Poughkeepsie, NY (US);
Ronald D. Goldblatt, Yorktown Heights, NY (US);
Sandra G. Malhotra, Beacon, NY (US);
Milan Paunovic, Port Washington, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An electroless touch-up process for repairing copper metallization deposited in dual damascene structures with high aspect ratios. An initial copper strike layer is produced by directional deposition techniques such that discontinuous sidewall coverage occurs. An evolutionary electroless touch-up process then proceeds to conformally grow the copper layer on all surfaces. The result of the evolutionary process is to produce a continuous copper strike layer that can be used with conventional electroplating techniques.