Mika Prunnila

Title: Innovations by Mika Prunnila

Introduction

Mika Prunnila is a notable inventor based in Espoo, Finland. He has made significant contributions to the field of technology, particularly in the area of quantum components and thermalization arrangements. With a total of 12 patents to his name, Prunnila's work showcases his innovative spirit and technical expertise.

Latest Patents

Among his latest patents is a "Device for shielding at least one quantum component." This device is designed to shield components from thermal radiation, featuring a first substrate and a second substrate that face each other. The device includes a shielding arrangement with electrically conductive materials that surround the first component, effectively preventing electromagnetic radiation from reaching the shielded area. Another significant patent is the "Thermalization arrangement at cryogenic temperatures." This arrangement consists of a dielectric substrate layer where devices or components can be positioned, along with a heat sink component attached to the substrate. The design minimizes thermal boundary resistance, ensuring efficient thermal management.

Career Highlights

Mika Prunnila has worked with Teknologian Tutkimuskeskus VTT Oy and Teknologian Tutkimuskeskus VTT, where he has further honed his skills and contributed to various innovative projects. His experience in these organizations has allowed him to collaborate with other experts in the field.

Collaborations

Prunnila has collaborated with notable coworkers such as Antti Jaakkola and Tuomas Pensala, enhancing his work through shared knowledge and expertise.

Conclusion

Mika Prunnila's contributions to technology through his patents and collaborations highlight his role as a leading inventor in his field. His innovative designs in shielding and thermalization arrangements continue to influence advancements in technology.