The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2026
Filed:
Sep. 20, 2023
Teknologian Tutkimuskeskus Vtt Oy, Espoo, FI;
Mika Prunnila, VTT, FI;
Alberto Ronzani, VTT, FI;
Emma Mykkänen, VTT, FI;
Antti Kemppinen, VTT, FI;
Janne Lehtinen, VTT, FI;
Teknologian tutkimuskeskus VTT Oy, Espoo, FI;
Abstract
A thermalization arrangement at cryogenic temperatures is dislcosed. The arrangement comprises a dielectric substrate layer on which substrate a device/s or component/s are positionable, and a heat sink component is attached on another side of the substrate. The arrangement further comprises a conductive layer between the substrate layer and the heat sink component. A joint between the substrate layer and the conductive layer has minimal phonon thermal boundary resistance. Energy of conductive layer phonons are arranged to be absorbed by electrons. Another joint between the conductive layer and the heat sink component is electrically conductive. The substrate layer and the conductive layer have similar acoustic properties.