The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 24, 2023
Filed:
Feb. 21, 2022
Teknologian Tutkimuskeskus Vtt Oy, Espoo, FI;
Mika Prunnila, VTT, FI;
Alberto Ronzani, VTT, FI;
Emma Mykkänen, VTT, FI;
Antti Kemppinen, VTT, FI;
Janne Lehtinen, VTT, FI;
Teknologian tutkimuskeskus VTT Oy, Espoo, FI;
Abstract
An inventive embodiment comprises a thermalization arrangement at cryogenic temperatures. The arrangement comprises a dielectric substrate () layer on which substrate a device/s or component/s () are positionable. A heat sink component () is attached on another side of the substrate. The arrangement further comprises a conductive layer () between the substrate layer () and the heat sink component (). A joint between the substrate layer () and the conductive layer () has minimal thermal boundary resistance. Another joint between the conductive layer () and the cooling heat sink layer () is electrically conductive.