Company Filing History:
Years Active: 1998-2009
Title: Michael Barrow: Innovator in Integrated Circuit Packaging
Introduction: Michael Barrow, located in El Dorado Hills, CA, is a prolific inventor with 24 patents to his name. His contributions to the field of integrated circuit packaging have been significant, particularly during his tenure at Intel Corporation, one of the leading technology companies in the world.
Latest Patents: Among his latest innovations is the "Perimeter Matrix Ball Grid Array Circuit Package with a Populated Center." This cutting-edge design features a ball grid array (BGA) integrated circuit package, incorporating an outer two-dimensional array of solder balls and a center array situated on the bottom surface of the package substrate. The solder balls are generally reflowed to effectively mount the package to a printed circuit board. An integrated circuit is mounted on the opposite surface of the substrate and is electrically interconnected with the solder balls through internal routing. This design minimizes solder stresses caused by the thermal expansion discrepancies between the integrated circuit and the substrate, enhancing reliability. Furthermore, the center solder balls provide a direct electrical and thermal path from the integrated circuit to the printed circuit board, which is crucial for optimal performance.
Career Highlights: Michael's career is marked by his pioneering work at Intel Corporation, where he has developed numerous innovative solutions that have shaped modern electronic devices. His expertise in integrated circuit packaging has led to significant advancements in the industry, making him a highly respected figure among his peers.
Collaborations: Throughout his career, Michael Barrow has collaborated with talented colleagues, including Behrooz Z Mehr and Tony Kean-Lee Lim. These partnerships have fostered a collaborative environment that drives innovation and pushes the boundaries of integrated circuit technology.
Conclusion: Michael Barrow's contributions to integrated circuit packaging, particularly through his patents and collaborations at Intel Corporation, have established him as a key innovator in the tech industry. His ongoing work continues to influence the design and functionality of electronic devices, ensuring that he remains at the forefront of technological advancements.