The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2002
Filed:
Sep. 16, 1998
Applicant:
Inventor:
Michael Barrow, El Dorado Hills, CA (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/3495 ;
U.S. Cl.
CPC ...
H01L 2/3495 ;
Abstract
An integrated circuit package which may have a thermally conductive tape that attaches a thermal element to a package housing. The housing encloses an integrated circuit that is mounted to a substrate. The thermally conductive tape may be configured to conform with any warpage in the package and prevent the creation of air void in the housing/thermal element interface.
Barrow, Michael. (2002). Integrated circuit package that includes a thermally conductive tape which attaches a thermal element to a plastic housing (U.S. Patent No. 6498390). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6498390
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile