The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 29, 1999
Filed:
Nov. 26, 1997
Michael Barrow, El Dorado Hills, CA (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
An integrated circuit package. The package includes a substrate which has a first surface, a second opposite surface and a plurality of corners. A plurality of solder balls may be soldered to the second surface of the substrate. The solder balls can be reflowed to a printed circuit board. An integrated circuit is mounted to the first surface of the substrate. Each corner has a conductive plane located on the first surface of the substrate. The package includes a metal lid that is thermally coupled to the integrated circuit and attached to the conductive plane at the corner of the substrate. The lid encloses the integrated circuit and provides a thermal path from the integrated circuit to the conductive planes at the corners of the substrate. The thermal path allows heat generated by the integrated circuit to flow through the lid and into the printed circuit board.