The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 14, 2000
Filed:
Sep. 16, 1998
Applicant:
Inventor:
Michael Barrow, El Dorado Hills, CA (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438122 ; 438126 ; 438127 ; 257707 ; 257706 ;
Abstract
An integrated circuit package which includes a thermal element that extends into a cavity of an injection molded housing. The cavity exposes at least a portion of an integrated circuit that is mounted to a substrate. The package includes an adhesive that attaches the thermal element to the housing and/or integrated circuit. The thermal element is assembled to the package after the housing has been molded onto the substrate and integrated circuit. Attaching the thermal element after the mold process can insure that the element is in direct thermal contact with the integrated circuit.