The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2000
Filed:
Jun. 25, 1998
Applicant:
Inventor:
Michael Barrow, El Dorado Hills, CA (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257773 ; 257774 ; 257734 ; 257778 ; 257779 ; 257780 ; 257786 ; 438612 ; 438613 ;
Abstract
An integrated circuit package which has a substrate that has a plurality of rectangular contact pads. Solder balls are attached to the contact pads of the substrate. The solder balls are reflowed to create solder joints which attach the substrate to a printed circuit board. The rectangular shape of the contact pads will induce a rectangular shape in the solder joints. The longitudinal axis of the contact pads and resultant solder joints may be aligned with the axes of expansion/contraction of the substrate when the package substrate is subjected to variations in temperature.