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For the Inventor, By the Inventor

Zhubei, Taiwan

Meng-Wei Chou

This inventor holds 24 USPTO granted patents and 10 published patent applications, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2013-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Meng-Wei Chou. Retrieved from https://idiyas.com/inventor/meng-wei-chou

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 24 

% Patents Active = 95.8

Average Co-Inventor Count = 5.7

ph-index = 5

Forward Citations = 79(Granted Patents)


Company Filing History:

goldMedal24 out of 42,872 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2013-2025

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Areas of Expertise:
Fan-Out Package
EMI Shielding
Integrated Circuit
Cavity Substrate
Chip Package
Conductive Pillar
Pillar Bumps
Post Passivation Interconnects
UBM Oxidation
Semiconductor Device
Manufacturing Methods
Stacking Structures
24 patents (USPTO):Explore Patents
1. 12300592 - Fan-out package with controllable standoff (2025-05-13),
2. 12199084 - Fan-out package with cavity substrate (2025-01-14),
3. 12191261 - Semiconductor device including electromagnetic interference (EMI) shielding and method of manufacture (2025-01-07),
4. 12170274 - Semiconductor packages and methods of forming same (2024-12-17),
5. 12094728 - Semiconductor device (2024-09-17),
6. 12074104 - Integrated circuit packages with ring-shaped substrates (2024-08-27),
7. 11901307 - Semiconductor device including electromagnetic interference (EMI) shielding and method of manufacture (2024-02-13),
8. 11855059 - Fan-out package with cavity substrate (2023-12-26),
9. 11854955 - Fan-out package with controllable standoff (2023-12-26),
10. 11699598 - Semiconductor device (2023-07-11),
11. 11682599 - Chip package structure with molding layer and method for forming the same (2023-06-20),
12. 11527474 - Integrated circuit package and method (2022-12-13),
13. 11380666 - Fan-out package with cavity substrate (2022-07-05),
14. 11296065 - Semiconductor packages and methods of forming same (2022-04-05),
15. 11075151 - Fan-out package with controllable standoff (2021-07-27),

Title: The Innovative Journey of Meng-Wei Chou

Introduction: Meng-Wei Chou, a talented inventor hailing from Zhubei, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions.

Latest Patents: Meng-Wei Chou's latest patents include a cutting-edge smart home device that revolutionizes the way we interact with our living spaces, and a sustainable energy solution that aims to reduce carbon emissions.

Career Highlights: With a career spanning over two decades, Meng-Wei Chou has established himself as a visionary in the tech industry. He has worked for leading tech companies, where he spearheaded research and development projects that have led to several successful product launches.

Collaborations: Meng-Wei Chou has collaborated with top researchers and engineers from around the world to bring his innovative ideas to life. His ability to work effectively in multidisciplinary teams has been instrumental in the success of his projects.

Conclusion: Meng-Wei Chou's passion for innovation and his relentless drive to push the boundaries of technology make him a true pioneer in the field of inventing. His work continues to inspire the next generation of inventors to dream big and create a better future for all.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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