This inventor holds 5 USPTO granted patents and 4 published patent applications and 3 EPO patents. Top assignee: Resonac Corporation. Active years: 2024-2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2024-2026
Title: The Innovations of Masayuki Miyaji
Introduction
Masayuki Miyaji is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of electronics through his innovative patents. With a total of four patents to his name, Miyaji has focused on advancements in solder bump technology and anisotropic conductive films.
Latest Patents
Miyaji's latest patents include a solder bump forming member and a method for manufacturing a solder bump forming member. The solder bump forming member features a base substrate with multiple recesses and solder particles that have an average particle diameter of 1 to 35 μm. Additionally, he has developed a method for producing an anisotropic conductive film, which involves several steps including preparation, accommodation, fusing, transfer, and layering to create a functional film.
Career Highlights
Miyaji is currently associated with Resonac Corporation, where he continues to innovate and develop new technologies. His work has been instrumental in enhancing the efficiency and effectiveness of electronic components.
Collaborations
Miyaji has collaborated with notable coworkers such as Kunihiko Akai and Yoshinori Ejiri, contributing to a dynamic and innovative work environment.
Conclusion
Masayuki Miyaji's contributions to the field of electronics through his patents and collaborations highlight his role as a key innovator. His work continues to influence advancements in technology and manufacturing processes.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile