The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2024
Filed:
Jun. 26, 2019
Applicant:
Showa Denko Materials Co., Ltd., Tokyo, JP;
Inventors:
Kunihiko Akai, Tokyo, JP;
Yoshinori Ejiri, Tokyo, JP;
Yuuhei Okada, Tokyo, JP;
Toshimitsu Moriya, Tokyo, JP;
Shinichirou Sukata, Tokyo, JP;
Masayuki Miyaji, Tokyo, JP;
Assignee:
RESONAC CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/02 (2006.01); B22F 1/00 (2022.01); B23K 35/26 (2006.01); B23K 103/08 (2006.01);
U.S. Cl.
CPC ...
B23K 35/0244 (2013.01); B22F 1/00 (2013.01); B23K 35/262 (2013.01); B23K 2103/08 (2018.08);
Abstract
The present invention relates to solder particles, each of which partially has a flat portion in the surface. By using these solder particles, electrodes facing each other are able to be appropriately connected, thereby achieving an anisotropic conductive material that exhibits excellent conduction reliability and excellent insulation reliability.