The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 11, 2025
Filed:
Dec. 15, 2020
Applicant:
Showa Denko Materials Co., Ltd., Tokyo, JP;
Inventors:
Kunihiko Akai, Tokyo, JP;
Masayuki Miyaji, Tokyo, JP;
Junichi Kakehata, Tokyo, JP;
Yoshinori Ejiri, Tokyo, JP;
Assignee:
RESONAC CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 3/00 (2006.01); B23K 1/00 (2006.01); B23K 3/08 (2006.01); B23K 101/36 (2006.01);
U.S. Cl.
CPC ...
B23K 3/087 (2013.01); B23K 1/0016 (2013.01); B23K 2101/36 (2018.08);
Abstract
A solder bump forming member including: a base substrate having a plurality of recesses; and solder particles in the recesses, in which the solder particle has an average particle diameter of 1 to 35 μm and a C.V. value of 20% or less, and a part of the solder particle projects from the recess, or in cross-sectional view, when a depth of the recess is designated as H, and a height of the solder particle is designated as H, H<His established.